Oxidation induced void formation in TEM specimens of Al-Cu-Li alloy

S. Nakahara, D. A. Tanner, A. K. Khan, J. S. Robinson

Research output: Contribution to journalArticlepeer-review

Abstract

A TEM study has revealed, for the first time, the presence of small (∼3 nm in diameter) voids attached to T1 (Al2CuLi) precipitates present in an artificially aged Al-Cu-Li alloy (Al-2·90Cu- 1·63Li-0·29Mg-0·28Ag-0·13Zr). These voids do not form from quenched in excess vacancies but are nucleated at the T1 phase/alloy interface from excess vacancies generated during oxidation of the TEM sample. It is concluded that these voids result from the Kirkendall effect with rapid oxidation of the TEM metal surface occurring by molecular oxygen migration through a highly defective surface oxide layer.

Original languageEnglish
Pages (from-to)783-788
Number of pages6
JournalMaterials Science and Technology (United Kingdom)
Volume27
Issue number4
DOIs
Publication statusPublished - Apr 2011

Keywords

  • Diffusion
  • Kirkendall effect
  • Thin films
  • Transmission electron microscopy
  • Vacancies

Fingerprint

Dive into the research topics of 'Oxidation induced void formation in TEM specimens of Al-Cu-Li alloy'. Together they form a unique fingerprint.

Cite this