Piecewise analysis and modeling of circuit pack temperature cycling data
- Toby Joyce
- , Edward J. Lisay
- , David E. Dalton
- , Jeff M. Punch
- , Michael S. Shellmer
- , Shirish N. Kher
- , Suresh Goyal
- Lucent Technologies' ReliabilityEngineering Group
- Trinity College Dublin
- Nokia
- American Society of Quality and Application Development Trends's Board of Advisors
- University of Massachusetts Boston
- Optical Networking Group
- ASME International
Research output: Contribution to journal › Article › peer-review