Point-of-source thermal management

Jeff Punch

doi:10.1109/ESIME.2005.1502890

Point-of-source thermal management

Jeff Punch

School of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Point-of-source thermal management technologies for electronic systems can be categorised as acting at the location of power generation - in contrast with conventional forced convection schemes which predominantly involve heat sinks cooled using system-level airflow. A range of point-of-source technologies is outlined, ranging from small-scale air movers and microchannel coolers, to heat pipes and thermoacoustic engines. Recent research at the Stokes Research Institute into point-of-source thermal management solutions is reviewed: micro fans; radiation heat pipes; and microchannel coolers. Finally, energy aspects of point-of-source cooling technologies are considered, with specific reference to their sink temperatures.

Original language	English
Title of host publication	Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
Publisher	IEEE Computer Society
Pages	688-694
Number of pages	7
ISBN (Print)	0780390628, 9780780390621
DOIs	https://doi.org/10.1109/ESIME.2005.1502890
Publication status	Published - 2005
Event	6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 - Berlin, Germany Duration: 18 Apr 2005 → 20 Apr 2005

Publication series

Name	Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
Volume	2005

Conference

Conference	6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
Country/Territory	Germany
City	Berlin
Period	18/04/05 → 20/04/05

Access to Document

10.1109/ESIME.2005.1502890

Cite this

Punch, J. (2005). Point-of-source thermal management. In Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 (pp. 688-694). Article 1502890 (Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005; Vol. 2005). IEEE Computer Society. https://doi.org/10.1109/ESIME.2005.1502890

Punch, Jeff. / Point-of-source thermal management. Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. IEEE Computer Society, 2005. pp. 688-694 (Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005).

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title = "Point-of-source thermal management",

abstract = "Point-of-source thermal management technologies for electronic systems can be categorised as acting at the location of power generation - in contrast with conventional forced convection schemes which predominantly involve heat sinks cooled using system-level airflow. A range of point-of-source technologies is outlined, ranging from small-scale air movers and microchannel coolers, to heat pipes and thermoacoustic engines. Recent research at the Stokes Research Institute into point-of-source thermal management solutions is reviewed: micro fans; radiation heat pipes; and microchannel coolers. Finally, energy aspects of point-of-source cooling technologies are considered, with specific reference to their sink temperatures.",

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year = "2005",

doi = "10.1109/ESIME.2005.1502890",

language = "English",

isbn = "0780390628",

series = "Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005",

publisher = "IEEE Computer Society",

pages = "688--694",

booktitle = "Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005",

note = "6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 ; Conference date: 18-04-2005 Through 20-04-2005",

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Punch, J 2005, Point-of-source thermal management. in Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005., 1502890, Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005, vol. 2005, IEEE Computer Society, pp. 688-694, 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005, Berlin, Germany, 18/04/05. https://doi.org/10.1109/ESIME.2005.1502890

Point-of-source thermal management. / Punch, Jeff.
Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. IEEE Computer Society, 2005. p. 688-694 1502890 (Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005; Vol. 2005).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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Punch J. Point-of-source thermal management. In Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. IEEE Computer Society. 2005. p. 688-694. 1502890. (Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005). doi: 10.1109/ESIME.2005.1502890

Point-of-source thermal management

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