Present and future thermal interface materials for electronic devices

Kafil M. Razeeb, Eric Dalton, Graham Lawerence William Cross, Anthony James Robinson

Research output: Contribution to journalReview articlepeer-review

Abstract

Packaging electronic devices is a growing challenge as device performance and power levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a challenge. Ensuring effective heat transfer from an integrated circuit and its heat spreader to a heat sink is a vital step in meeting this challenge. The projected power density and junction-to-ambient thermal resistance for high-performance chips at the 14 nm generation are >100 Wcm−2 and <0.2 °CW−1, respectively. The main bottleneck in reducing the net thermal resistance are the thermal resistances of the thermal interface material (TIM). This review evaluates the current state of the art of TIMs. Here, the theory of thermal surface interaction will be addressed and the practicalities of the measurement techniques and the reliability of TIMs will be discussed. Furthermore, the next generation of TIMs will be discussed in terms of potential thermal solutions in the realisation of Internet of Things.

Original languageEnglish
Pages (from-to)1-21
Number of pages21
JournalInternational Materials Reviews
Volume63
Issue number1
DOIs
Publication statusPublished - 2018

Keywords

  • Carbon structure
  • Polymer composite
  • Solder
  • Thermal conductivity
  • Thermal interface materials
  • Thermal resistance

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