TY - JOUR
T1 - Present and future thermal interface materials for electronic devices
AU - Razeeb, Kafil M.
AU - Dalton, Eric
AU - Cross, Graham Lawerence William
AU - Robinson, Anthony James
N1 - Publisher Copyright:
© 2017 Institute of Materials, Minerals and Mining and ASM International Published by Taylor & Francis on behalf of the Institute and ASM International.
PY - 2018
Y1 - 2018
N2 - Packaging electronic devices is a growing challenge as device performance and power levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a challenge. Ensuring effective heat transfer from an integrated circuit and its heat spreader to a heat sink is a vital step in meeting this challenge. The projected power density and junction-to-ambient thermal resistance for high-performance chips at the 14 nm generation are >100 Wcm−2 and <0.2 °CW−1, respectively. The main bottleneck in reducing the net thermal resistance are the thermal resistances of the thermal interface material (TIM). This review evaluates the current state of the art of TIMs. Here, the theory of thermal surface interaction will be addressed and the practicalities of the measurement techniques and the reliability of TIMs will be discussed. Furthermore, the next generation of TIMs will be discussed in terms of potential thermal solutions in the realisation of Internet of Things.
AB - Packaging electronic devices is a growing challenge as device performance and power levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a challenge. Ensuring effective heat transfer from an integrated circuit and its heat spreader to a heat sink is a vital step in meeting this challenge. The projected power density and junction-to-ambient thermal resistance for high-performance chips at the 14 nm generation are >100 Wcm−2 and <0.2 °CW−1, respectively. The main bottleneck in reducing the net thermal resistance are the thermal resistances of the thermal interface material (TIM). This review evaluates the current state of the art of TIMs. Here, the theory of thermal surface interaction will be addressed and the practicalities of the measurement techniques and the reliability of TIMs will be discussed. Furthermore, the next generation of TIMs will be discussed in terms of potential thermal solutions in the realisation of Internet of Things.
KW - Carbon structure
KW - Polymer composite
KW - Solder
KW - Thermal conductivity
KW - Thermal interface materials
KW - Thermal resistance
UR - http://www.scopus.com/inward/record.url?scp=85016111341&partnerID=8YFLogxK
U2 - 10.1080/09506608.2017.1296605
DO - 10.1080/09506608.2017.1296605
M3 - Review article
AN - SCOPUS:85016111341
SN - 0950-6608
VL - 63
SP - 1
EP - 21
JO - International Materials Reviews
JF - International Materials Reviews
IS - 1
ER -