Resistance measurements and simultaneous AFM imaging on electrodeposited copper films during room temperature aging

S. Ahmed, T. T. Ahmed, D. N. Buckley, G. Gooberman, S. Nakahara

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Electrical resistance measurements of 30 - 120 nm electrodeposited copper films were made simultaneously with atomic force microscopy (AFM) imaging. Resistance decreases relatively rapidly immediately after deposition. It reaches a minimum, typically after less than an hour, and then increases to a maximum and subsequently decays. AFM showed the formation of smaller surface features during the period of increase in resistance. Subsequent to the maximum in resistance, features increased in size, consistent with recrystallization and grain growth. It is speculated that the increase in resistance may to be related to structural changes in the film and that the early decrease in resistance may reflect a contribution from the out-diffusion of excess vacancies. copyright The Electrochemical Society.

Original languageEnglish
Title of host publicationElectrochemical Processing in ULSI and MEMS 2
PublisherElectrochemical Society Inc.
Pages229-241
Number of pages13
Edition6
ISBN (Print)9781566775175
DOIs
Publication statusPublished - 2006
Event209th ECS Meeting - Denver, CO, United States
Duration: 7 May 200611 May 2006

Publication series

NameECS Transactions
Number6
Volume2
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

Conference209th ECS Meeting
Country/TerritoryUnited States
CityDenver, CO
Period7/05/0611/05/06

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