Simulation and validation of SiO2 LPCVD from TEOS in a vertical 300 mm multi-wafer reactor

G. J. Schoof, C. R. Kleijn, H. E.A. Van Den Akker, T. G.M. Oosterlaken, H. J.C.M. Terhorst, F. Huussen

Research output: Contribution to journalConference articlepeer-review

Abstract

Combining a slightly modified version of the chemical reaction mechanism for silicon-dioxide LPCVD from TEOS as proposed by Coltrin and coworkers, and the commercially available CFD program CFD-ACE+, a 2D model has been derived for gas flow, transport phenomena and deposition chemistry in the ASM A412 vertical 300mm multi-wafer reactor. Silicon-dioxide deposition from TEOS is strongly influenced by gas-phase reactions, producing a reactive intermediate that is responsible for the majority of deposition. This phenomenon underlines the importance of the chemistry model in simulations. As a result of the gas phase intermediate, strong radial non-uniformities are observed. The simulation results have been validated against experimental growth rate data for various process conditions.

Original languageEnglish
Pages (from-to)Pr4/51-Pr4/62
JournalJournal De Physique. IV : JP
Volume12
Issue number4
DOIs
Publication statusPublished - Jun 2002
Externally publishedYes
Event13th European Conference on Chemical Vapor Deposition - Glyfada, Athens, Greece
Duration: 26 Aug 200131 Aug 2001

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