SnAgGu micro-ball grid array (BGA) solder joint evaluation using a torsion mechanical fatigue test method

Claire Ryan, Bryan A. Rodgers, Jeff M. Punch

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Fingerprint

Dive into the research topics of 'SnAgGu micro-ball grid array (BGA) solder joint evaluation using a torsion mechanical fatigue test method'. Together they form a unique fingerprint.

Engineering

Material Science