Stress and microstructure in electrodeposited copper nanofilms and the effect of chloride and polyethylene glycol (PEG)

Engineering

• Mols 100%
• Atomic Force Microscopy 50%
• Local Stress 50%
• Deposition Rate 50%
• In Situ Stress Measurement 50%
• Tensile Direction 50%
• Grain Boundaries 50%

Chemical Engineering

• Polyethylene Glycol 100%
• Stress Measurement 66%
• Deposition Rate 33%
• Film 33%
• Electrodeposition 33%

Material Science

• Polyethylene Glycol 100%
• Film 33%
• Stress Measurement 33%
• In Situ Stress Measurement 33%
• Electrodeposition 33%
• Grain Boundaries 33%