TY - JOUR
T1 - Sustainable Dielectrics from Sintered Soyabean Powders
T2 - Structure, Thermal and Piezoelectric Properties
AU - Barnana, Hema Dinesh
AU - O'Mahony, Charlie
AU - Roy, Krittish
AU - Haq, Ehtsham Ul
AU - Tofail, Syed A.M.
N1 - Publisher Copyright:
© 1994-2012 IEEE.
PY - 2024
Y1 - 2024
N2 - In this work, we approached sintering and crystallization of soyabean powders with a 'cold sintering' approach to develop a bioelectret for potential high-frequency communication applications. Structural disintegration and phase evolution of glycinin globulin proteins present in soyabean powders in relation to sintering parameters were investigated using X ray diffraction (XRD), Fourier transform infrared (FTIR) spectroscopy, and thermogravimetry analysis (TGA). Piezoresponse force microscopy (PFM) showed some localized area with weak (0.7 pm/V) to reasonable (2.7 pm/V) out of plane piezoresponse in cold pressed and sintered soyabeans, respectively. Sintered bioelectrets did not show any macroscopic piezoelectricity, however.
AB - In this work, we approached sintering and crystallization of soyabean powders with a 'cold sintering' approach to develop a bioelectret for potential high-frequency communication applications. Structural disintegration and phase evolution of glycinin globulin proteins present in soyabean powders in relation to sintering parameters were investigated using X ray diffraction (XRD), Fourier transform infrared (FTIR) spectroscopy, and thermogravimetry analysis (TGA). Piezoresponse force microscopy (PFM) showed some localized area with weak (0.7 pm/V) to reasonable (2.7 pm/V) out of plane piezoresponse in cold pressed and sintered soyabeans, respectively. Sintered bioelectrets did not show any macroscopic piezoelectricity, however.
KW - Bioelectret
KW - Cold Sintering
KW - Glycinin
KW - Soyabeans
KW - Sustainable Dielectrics
UR - http://www.scopus.com/inward/record.url?scp=85203546991&partnerID=8YFLogxK
U2 - 10.1109/TDEI.2024.3452951
DO - 10.1109/TDEI.2024.3452951
M3 - Article
AN - SCOPUS:85203546991
SN - 1070-9878
VL - 31
SP - 2270
EP - 2274
JO - IEEE Transactions on Dielectrics and Electrical Insulation
JF - IEEE Transactions on Dielectrics and Electrical Insulation
IS - 5
ER -