Synergistic thermal and hydrodynamic effects in 3D-printed heat sinks with intricate microchannel patterns

A compelling solution to the issue of high heat flux generated by flexible electronic devices has been found in liquid-based microfluidic cooling devices. It has been earlier realized that the varying microchannel hydrodynamics influences the overall heat transfer in these devices. However, microfluidic cooling devices that incorporate intricate microchannels have not been explored to their full potential. In this study, we investigate the use of 3-D intricate microchannel geometries in microfluidic heat sinks, their generated hydrodynamics, and their profound impact on the overall heat transfer process. Utilizing 3D-printed scaffold removal technology, three distinct microfluidic devices were fabricated, each distinguishable by its cross-sectional shape of the microchannel designs (coil, square, and triangle). These microfluidic devices, based on Polydimethylsiloxane-Graphene oxide (PDMS-GO) as substrate material, have been examined experimentally and numerically for their heat dissipation capacities under constant temperature heat source of 358 K at flow rates ranging from 40 to 400 μL/min. Experimental observation illustrates that the coil-microchannel configuration exhibited superior heat dissipation capabilities, outperforming both the square and triangle microchannels across all flow settings. Furthermore, numerical simulations corroborated this experimental finding by providing insights into through-plane temperature distribution, heat transfer coefficient, pressure drop, and channel hydrodynamics. Our study intends to advance the understanding of microchannel cooling, as well as emphasizes the importance of geometrical configuration towards optimal electronic hotspot cooling.