TY - GEN
T1 - The development of an integrated fan and heat sink solution for thermal management in low profile applications
AU - Walsh, Ed
AU - Grimes, Ronan
PY - 2006
Y1 - 2006
N2 - The increasing heat flux densities from portable electronics are leading to new methodologies being implemented to provide thermal management within such devices. Many technologies are under development to transport heat within electronic equipment to allow it to be transported into the surroundings via conduction, natural convection and radiation. Few have considered the approach of implementing a forced convection cooling solution in such devices. This work addresses the potential of a low profile integrated fan and heat sink solution to electronics thermal management issues of the future, particularly focusing upon possible solutions in low profile portable electronics. We investigate two heat sink designs with mini channel features, applicable to low profile applications. The thermal performance of the heat sinks is seen to differ by approximately 40% and highlights the importance of efficient heat sink design at this scale.
AB - The increasing heat flux densities from portable electronics are leading to new methodologies being implemented to provide thermal management within such devices. Many technologies are under development to transport heat within electronic equipment to allow it to be transported into the surroundings via conduction, natural convection and radiation. Few have considered the approach of implementing a forced convection cooling solution in such devices. This work addresses the potential of a low profile integrated fan and heat sink solution to electronics thermal management issues of the future, particularly focusing upon possible solutions in low profile portable electronics. We investigate two heat sink designs with mini channel features, applicable to low profile applications. The thermal performance of the heat sinks is seen to differ by approximately 40% and highlights the importance of efficient heat sink design at this scale.
UR - https://www.scopus.com/pages/publications/33846975817
U2 - 10.1115/icnmm2006-96055
DO - 10.1115/icnmm2006-96055
M3 - Conference contribution
AN - SCOPUS:33846975817
SN - 0791847608
SN - 9780791847602
T3 - Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006
SP - 279
EP - 284
BT - Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006
PB - American Society of Mechanical Engineers
T2 - 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006
Y2 - 19 June 2006 through 21 June 2006
ER -