TY - GEN
T1 - The heat transfer performance in a square channel downstream of a representative shape memory alloy structure for microfluidics applications
AU - Waddell, A. M.
AU - Punch, J.
AU - Stafford, J.
AU - Jeffers, N.
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/4/30
Y1 - 2015/4/30
N2 - Some of the largest heat densities that can be found in contemporary engineering applications are present in 3D chip stacks (~103 W/cm3), and micro-fluidic systems have been proposed to cool these devices. As the chip heat flux is non-homogenous, hot spots exist which require greater local heat transfer coefficients than the surrounding regions. To cool on-chip hot-spots, a passively actuated structure could be placed in the micro-channel and, deploying as necessary, to regulate temperature by disturbing flow in a target location. In this work, the heat transfer coefficients downstream of a representative Shape Memory Alloy (SMA) structure were measured for low Reynolds numbers (90 - 200) in a o4mm miniature channel, using a joule heated foil technique. The heat transfer coefficient was seen to increase with an increase in Re, and/or a decrease in the valve opening ratio. Two peaks in the heat transfer coefficient were observed where the flow exited the valve. The area averaged heat transfer coefficients obtained in this work are useful parameters in the modeling and design of practical micro-fluidic cooling systems.
AB - Some of the largest heat densities that can be found in contemporary engineering applications are present in 3D chip stacks (~103 W/cm3), and micro-fluidic systems have been proposed to cool these devices. As the chip heat flux is non-homogenous, hot spots exist which require greater local heat transfer coefficients than the surrounding regions. To cool on-chip hot-spots, a passively actuated structure could be placed in the micro-channel and, deploying as necessary, to regulate temperature by disturbing flow in a target location. In this work, the heat transfer coefficients downstream of a representative Shape Memory Alloy (SMA) structure were measured for low Reynolds numbers (90 - 200) in a o4mm miniature channel, using a joule heated foil technique. The heat transfer coefficient was seen to increase with an increase in Re, and/or a decrease in the valve opening ratio. Two peaks in the heat transfer coefficient were observed where the flow exited the valve. The area averaged heat transfer coefficients obtained in this work are useful parameters in the modeling and design of practical micro-fluidic cooling systems.
UR - http://www.scopus.com/inward/record.url?scp=84945185956&partnerID=8YFLogxK
U2 - 10.1109/SEMI-THERM.2015.7100172
DO - 10.1109/SEMI-THERM.2015.7100172
M3 - Conference contribution
AN - SCOPUS:84945185956
T3 - Annual IEEE Semiconductor Thermal Measurement and Management Symposium
SP - 273
EP - 279
BT - 31st Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2015 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 31st Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2015
Y2 - 15 March 2015 through 19 March 2015
ER -