The heat transfer performance in a square channel downstream of a representative shape memory alloy structure for microfluidics applications

A. M. Waddell, J. Punch, J. Stafford, N. Jeffers

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Some of the largest heat densities that can be found in contemporary engineering applications are present in 3D chip stacks (~103 W/cm3), and micro-fluidic systems have been proposed to cool these devices. As the chip heat flux is non-homogenous, hot spots exist which require greater local heat transfer coefficients than the surrounding regions. To cool on-chip hot-spots, a passively actuated structure could be placed in the micro-channel and, deploying as necessary, to regulate temperature by disturbing flow in a target location. In this work, the heat transfer coefficients downstream of a representative Shape Memory Alloy (SMA) structure were measured for low Reynolds numbers (90 - 200) in a o4mm miniature channel, using a joule heated foil technique. The heat transfer coefficient was seen to increase with an increase in Re, and/or a decrease in the valve opening ratio. Two peaks in the heat transfer coefficient were observed where the flow exited the valve. The area averaged heat transfer coefficients obtained in this work are useful parameters in the modeling and design of practical micro-fluidic cooling systems.

Original languageEnglish
Title of host publication31st Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2015 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages273-279
Number of pages7
ISBN (Electronic)9781479986002
DOIs
Publication statusPublished - 30 Apr 2015
Event31st Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2015 - San Jose, United States
Duration: 15 Mar 201519 Mar 2015

Publication series

NameAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
Volume2015-April
ISSN (Print)1065-2221

Conference

Conference31st Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2015
Country/TerritoryUnited States
CitySan Jose
Period15/03/1519/03/15

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