TY - GEN
T1 - The influence of the Pb-free solder alloy composition and processing parameters on thermal fatigue performance of a ceramic chip resistor
AU - Coyle, Richard
AU - Reid, Michael
AU - Ryan, Claire
AU - Popowich, Richard
AU - Read, Peter
AU - Fleming, Debra
AU - Collins, Maurice
AU - Punch, Jeff
AU - Chatterji, Indraneel
PY - 2009
Y1 - 2009
N2 - This paper presents the results of a thermal fatigue study of a 2512 ceramic chip resistor assembled with various Pb free solders including SnCu, SAC105, SAC205, SAC305, and SAC405. The test matrix also includes some limited evaluations with other variables such as cooling rate (solidification rate), thermal preconditioning and nitrogen (inert) reflow atmosphere. The matrix also includes a SnPb eutectic control cells. The resistor test vehicle provides an expedient and self-consistent method for evaluating the relative fatigue performance of the various alloys. A study of the as-assembled solder joints was conducted to characterize the microstructure of the solder joints with varying silver content. Thermal fatigue was evaluated using an accelerated temperature cycle of 0/100 °C with dwell times of 10 and 60 minutes. The test results show a direct relationship between characteristic fatigue life and Ag content, with the higher Ag content alloys outperforming those with the lowest Ag content. As might be anticipated, there also was a consistent inverse relationship between fatigue life and dwell time for the Pb free solders. The failure analysis and microstructural evolution is characterized with optical metallography and scanning electron microscopy and the fatigue reliability of thePb free solders is discussed in terms of the microstructures
AB - This paper presents the results of a thermal fatigue study of a 2512 ceramic chip resistor assembled with various Pb free solders including SnCu, SAC105, SAC205, SAC305, and SAC405. The test matrix also includes some limited evaluations with other variables such as cooling rate (solidification rate), thermal preconditioning and nitrogen (inert) reflow atmosphere. The matrix also includes a SnPb eutectic control cells. The resistor test vehicle provides an expedient and self-consistent method for evaluating the relative fatigue performance of the various alloys. A study of the as-assembled solder joints was conducted to characterize the microstructure of the solder joints with varying silver content. Thermal fatigue was evaluated using an accelerated temperature cycle of 0/100 °C with dwell times of 10 and 60 minutes. The test results show a direct relationship between characteristic fatigue life and Ag content, with the higher Ag content alloys outperforming those with the lowest Ag content. As might be anticipated, there also was a consistent inverse relationship between fatigue life and dwell time for the Pb free solders. The failure analysis and microstructural evolution is characterized with optical metallography and scanning electron microscopy and the fatigue reliability of thePb free solders is discussed in terms of the microstructures
UR - http://www.scopus.com/inward/record.url?scp=70349684390&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2009.5074048
DO - 10.1109/ECTC.2009.5074048
M3 - Conference contribution
AN - SCOPUS:70349684390
SN - 9781424444762
T3 - Proceedings - Electronic Components and Technology Conference
SP - 423
EP - 430
BT - 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009
T2 - 2009 59th Electronic Components and Technology Conference, ECTC 2009
Y2 - 26 May 2009 through 29 May 2009
ER -