Thermal fatigue and failure analysis of SnAgCu solder alloys with minor Pb additions

Engineering

• Failure Analysis 100%
• Fatigue Analysis 100%
• Thermal Fatigue 100%
• Joints (Structural Components) 50%
• Fatigue Performance 50%
• Printed Circuit Board 50%
• Eutectics 50%
• Ramp Rate 50%
• Thermal Cycle 50%
• Fractography 50%
• Failure Data 50%
• Characteristic Life 50%
• Microstructural Evolution 50%
• Alloy Composition 50%
• Test Vehicle 50%

Material Science

• Thermal Fatigue 100%
• Scanning Electron Microscopy 50%
• Solder Joint 50%
• Electron Microscopy 50%
• Weibull Distribution 50%
• Fractography 50%
• Microstructural Evolution 50%
• Phase Composition 50%