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Thermal interaction between electronic components
John M. Lohan
, Mark R.D. Davies
SSPC - the Research Ireland Centre for Pharmaceuticals
School of Engineering
University of Limerick
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Engineering
Heat Resistance
100%
Test Board
50%
Printed Circuit Board
25%
Experimental Result
25%
Applicability
25%
Forced Air
25%
Thermal Performance
25%
Air Velocity
25%
Channel Flow
25%
System Designer
25%
Junction Temperature
25%
Single Component
25%
Standard Test Method
25%
Ambient Thermal Resistance
25%
Component Side
25%
Mean Time between Failure
25%
Design Tool
25%