TY - GEN
T1 - Three-dimensional heat conduction through rectangular multiple layer plane substrates
AU - Punch, J.
AU - Davies, M.
PY - 1993
Y1 - 1993
N2 - Sources dissipating heat by conduction through thin rectangular substrates are commonly found in electronic equipment. In this paper, a review of the literature pertinent to heat transfer through such substrates is presented. An exact analytical expression is derived for the steady-state temperature distribution within each layer of a multiple layer substrate, allowing for orthotropic thermal conductivity of the material. The sources, mounted on one side of the substrate, are specified as a flux boundary condition using a double Fourier cosine series.Cooling is by convection from both sides of the substrate. Expressions are developed for the heat flux through the substrate and for the thermal resistance between the sources and ambient. Finally, a parametric study is presented, illustrating the influences on the temperature distribution of the materials' thermal conductivity, the substrate dimensions, the convective heat transfer conditions, and the source flux distribution, shape and position.
AB - Sources dissipating heat by conduction through thin rectangular substrates are commonly found in electronic equipment. In this paper, a review of the literature pertinent to heat transfer through such substrates is presented. An exact analytical expression is derived for the steady-state temperature distribution within each layer of a multiple layer substrate, allowing for orthotropic thermal conductivity of the material. The sources, mounted on one side of the substrate, are specified as a flux boundary condition using a double Fourier cosine series.Cooling is by convection from both sides of the substrate. Expressions are developed for the heat flux through the substrate and for the thermal resistance between the sources and ambient. Finally, a parametric study is presented, illustrating the influences on the temperature distribution of the materials' thermal conductivity, the substrate dimensions, the convective heat transfer conditions, and the source flux distribution, shape and position.
UR - http://www.scopus.com/inward/record.url?scp=0027876698&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:0027876698
SN - 079181162X
T3 - American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
SP - 89
EP - 100
BT - Heat Transfer Measurements and Analysis
A2 - Chow, Louis C.
A2 - Emery, Ashley F.
PB - Publ by ASME
T2 - The 29th National Heat Transfer Conference
Y2 - 8 August 1993 through 11 August 1993
ER -