Transferred III-V materials - novel devices and integration

B. Corbett, R. Loi, D. Quinn, J. O'Callaghan, N. Liu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Separating the substrate allows thin layers of III-V photonic semiconductor materials and devices to be integrated on foreign templates using transfer-printing. We demonstrate advanced light emitting and detecting devices based on this principle.

Original languageEnglish
Title of host publicationAdvanced Photonics, IPRSN 2017
PublisherOptica Publishing Group (formerly OSA)
ISBN (Print)9781943580309
DOIs
Publication statusPublished - 2017
EventAdvanced Photonics, IPRSN 2017 - New Orleans, United States
Duration: 24 Jul 201727 Jul 2017

Publication series

NameOptics InfoBase Conference Papers
VolumePart F52-IPRSN 2017
ISSN (Electronic)2162-2701

Conference

ConferenceAdvanced Photonics, IPRSN 2017
Country/TerritoryUnited States
CityNew Orleans
Period24/07/1727/07/17

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