Transient hygrothermal behaviour of portable electronics

Jeff Punch, Ronan Grimes, Greg Heaslip, Timo Galkin, Kyösti Väkevälinen, Vesa Kyyhkynen, Erkko Elonen

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The theme of this paper is the design of portable electronic systems for hot and humid conditions. In particular, portable products such as mobile phones. CD players and digital cameras can experience high relative humidity and condensation. It is important to understand the behaviour of portable products in different usage environments in order to develop more accurate specifications, simulation models and verification methods. In this paper, the response of portable electronics to time-varying conditions of temperature and humidity is considered in order to assess the conditions likely to precipitate condensation. A first-order coupled hygrothermal model is developed to represent the response of a typical portable product to variations in ambient temperature and humidity. Simple time constants are derived to describe transient hygrothermal response. Experimental characterisation of a sample product is performed to evaluate the parameters of the model, and it is demonstrated how movement from one environment to another can induce condensation to occur on the internal and external surfaces of a portable product.

Original languageEnglish
Title of host publicationProceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
PublisherIEEE Computer Society
Pages398-405
Number of pages8
ISBN (Print)0780390628, 9780780390621
DOIs
Publication statusPublished - 2005
Event6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005 - Berlin, Germany
Duration: 18 Apr 200520 Apr 2005

Publication series

NameProceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
Volume2005

Conference

Conference6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005
Country/TerritoryGermany
CityBerlin
Period18/04/0520/04/05

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