TY - GEN
T1 - Transient thermal behaviour of a board-mounted 160-lead plastic quad flat pack
AU - Lohan, J.
AU - Davies, M.
PY - 1994
Y1 - 1994
N2 - Severe transient thermal effects are induced in electronic components during assembly, reliability testing and operation. Although component reliability is a strong function of temperature, there is no absolute relationship to describe its dependency on the environmental conditions imposed by these processes. In this paper, the thermal response of a board-mounted 160-lead Plastic Quad Flat Pack to typical reliability test environments was investigated experimentally. The steady state thermal performance of the component in forced convection, and its unsteady response to air temperature cycling, power cycling and a combination of these were evaluated. The effects of various test cycle configurations, consisting of different air temperature ramp rates, dwell times, power level and air velocity, on the component response are clearly shown.
AB - Severe transient thermal effects are induced in electronic components during assembly, reliability testing and operation. Although component reliability is a strong function of temperature, there is no absolute relationship to describe its dependency on the environmental conditions imposed by these processes. In this paper, the thermal response of a board-mounted 160-lead Plastic Quad Flat Pack to typical reliability test environments was investigated experimentally. The steady state thermal performance of the component in forced convection, and its unsteady response to air temperature cycling, power cycling and a combination of these were evaluated. The effects of various test cycle configurations, consisting of different air temperature ramp rates, dwell times, power level and air velocity, on the component response are clearly shown.
UR - http://www.scopus.com/inward/record.url?scp=0027928786&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:0027928786
SN - 0780313739
SN - 9780780313736
T3 - Proceedings of the Intersociety Conference on Thermal Phenomena in Electronic Systems
SP - 108
EP - 116
BT - Concurrent Engineering and Thermal Phenomena
PB - Publ by IEEE
T2 - Proceedings of the Intersociety Conference on Thermal Phenomena in Electronic Systems
Y2 - 4 May 1994 through 7 May 1994
ER -