TY - JOUR
T1 - Wall boiling in a vertical annulus
T2 - Effect of inlet subcooling and mass flow rate
AU - Husain, Shahid
AU - Siddiqui, M. Altamush
AU - Ahmad Khan, Suhail
N1 - Publisher Copyright:
© 2019, © 2019 Taylor & Francis Group, LLC.
PY - 2019/6/3
Y1 - 2019/6/3
N2 - Numerical studies on low flow rate convection boiling in a vertical annulus has been carried out to predict effects of inlet subcooling and mass flow rate. The aspect ratio of vertical annulus is 352 while the annular gap is 3.5 mm. RPI wall boiling model is used for the development of present code and the results are verified with those available in literature. The results show that onset of significant void (OSV) can be delayed to achieve maximum heat transfer by increasing the liquid subcooling and liquid mass flow rate. The average Nusselt number increases almost linearly with increase in the mass flow rate as well as the inlet subcooling. At high heat flux, very high wall temperatures are observed with low subcooling and low mass flow rates. This should be avoided for enhanced safety.
AB - Numerical studies on low flow rate convection boiling in a vertical annulus has been carried out to predict effects of inlet subcooling and mass flow rate. The aspect ratio of vertical annulus is 352 while the annular gap is 3.5 mm. RPI wall boiling model is used for the development of present code and the results are verified with those available in literature. The results show that onset of significant void (OSV) can be delayed to achieve maximum heat transfer by increasing the liquid subcooling and liquid mass flow rate. The average Nusselt number increases almost linearly with increase in the mass flow rate as well as the inlet subcooling. At high heat flux, very high wall temperatures are observed with low subcooling and low mass flow rates. This should be avoided for enhanced safety.
UR - http://www.scopus.com/inward/record.url?scp=85074866443&partnerID=8YFLogxK
U2 - 10.1080/10407782.2019.1612154
DO - 10.1080/10407782.2019.1612154
M3 - Article
AN - SCOPUS:85074866443
SN - 1040-7782
VL - 75
SP - 776
EP - 793
JO - Numerical Heat Transfer; Part A: Applications
JF - Numerical Heat Transfer; Part A: Applications
IS - 11
ER -